Morphology, microstructure, and doping behaviour: A comparison between different deposition methods for poly?Si/SiO <sub> <i>x</i> </sub> passivating contacts

نویسندگان

چکیده

Crystallographic structures, optoelectronic properties, and nanoscale surface morphologies of ex situ phosphorus-doped polycrystalline silicon (poly-Si)/SiOx passivating contacts, formed by different deposition methods (sputtering, plasma-enhanced chemical vapour [PECVD], low-pressure [LPCVD]), are investigated compared. Across all these technologies, we noted the same trend: higher diffusion temperatures yield films that more crystalline but have rougher due to bigger crystal grains. Also, recrystallization process as-deposited Si starts from SiOx interface, rather than film bulk. However, there some distinct differences among technologies. First, LPCVD method yields lowest rate, roughest surfaces, smallest degree crystallinity on finished poly-Si films. In contrast, PECVD has highest rate smoothest surfaces for both annealed Second, sputtered contain only an amorphous phase, whereas already phase. Third, phosphorus in-diffusion into substrate depends strongly initial thickness, other two methods, it is weakly dependent thickness. Finally, passivation quality every type responses thickness temperature, suggesting doping optimization should be performed independently.

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ژورنال

عنوان ژورنال: Progress in Photovoltaics

سال: 2021

ISSN: ['1062-7995', '1099-159X']

DOI: https://doi.org/10.1002/pip.3411